Platform for infrared heating of printed circuit boards from below when dismantling (assembling) electronic components.
A cover covering the platform for uniform heating of the working area throughout the entire volume, as well as for directing the air flow from the fan in cooling mode.
The platform is a massive aluminum plate that evenly distributes heat from the heater over the entire surface.
The high thermal conductivity of aluminum makes it possible to work not only with multilayer boards made of fiberglass, but also with printed circuit boards based on aluminum (these are often used for mounting high-power LEDs).
The upper limit of the temperature adjustment range of 450°C is more than sufficient for work with lead-free solders and pastes.
The rotary-type cooling fan is mounted on the rear end of the platform and can evenly blow the entire surface.
This design feature makes it possible to maintain the soldering thermal profile, in fact, turning the heater into a miniature oven for soldering SMD components, in addition, there is a metal cover for covering the platform.
Temperature stabilization algorithm - PID controller.
Microprocessor control unit with temperature setting memory.
Heating duration timer.
In the event of a malfunction, an error code is displayed on the indicator.
Characteristics:
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supply voltage: 220V, 50 Hz
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heater power: 800 W
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temperature adjustment range: 0°C - 450°C
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timer setting range: 0 - 999 s
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working area size: 180 x 240 mm
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dimensions: 300 x 210 x 250 mm
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gross weight: 6.5KG
The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
