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KSM-386 -Two-component thermosetting solder mask, with good printing properties, fast curing after application with excellent adhesion, heat resistance, chemical resistance.
Applied through a stencil with a pattern
Baked at a temperature of 100 °C for 1 hour.
Thermal curing solder mask (KSM-386 series)
KSM-386 series for two-component heat curing solder mask, with good printability, fast curing, curing after coating with excellent adhesion, heat resistance and chemical resistance.
Ink features:
Items Head
Special properties
Preparation Notes
Yen color
Green color
Fine degree
≤ 8 m
0 ~ 25μm Fineness gauge
The mixing ratio
Main agent / curing agent = 23/2
Weight ratio
After mixing viscosity (25° C)
250 ± 50dPa · s
VT-04F
Mixed density (25 ° C)
1.20 ~1.40g/ Ml
Net Head
36 ~ 51T
Film thickness
18 ~ 22μm
Cured
Curing conditions
150 ° C, 30 to 60 minutes
Hot air circulation oven
You can use the time after mixing
24 hours
Less than25 ° CStore
Pencil Hardness
≥ 6H
Pencil Hardness Tester
Adhesion
100/100
Experimental hundred cells
Resistance soldering performance
288 ?, 10s , 3 times
No blistering off
IPC-SM-840D 3.7.3
Environmental standards
Comply with RoHS directive
SGS detection
Package installed
Main agent:920gHardener80g
Customers can choose according to demand
Main agent:4.6kgHardener0.4kg
Storage period
After the production date 6 months
Less than25 ° CDark storage
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The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
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The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
