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Medium melting tin-lead solder paste with no-clean flux. Designed for reflow soldering of SMD elements. For production and repair. Sn67Pb37 alloy. Bank of 500 grams.
NOT available.
Expected price:2 520,00UAH
from 1 pc :
—
2 520,00
UAH
from 3 pcs :
—
2 469,00
UAH
( -2,0%)
from 10 pcs :
—
2 419,00
UAH
( -4,0%)
Prices are indicated at the time of product availability and may change upon receipt
818 is a lead-based solder paste containing halogen-free no-clean flux (J-STD-004 type ROL0). After the soldering process, a minimum amount of transparent, non-corrosive, non-conductive flux residues remains on the PCB compared to conventional solder pastes.
The properties of the chemical formula of this paste provide excellent activity, long-term retention of adhesive properties to hold components on the printed circuit board.
Advantages:
Minimal amount of flux residues after the soldering process
Excellent activity
Retention of adhesive properties up to 48 hours
Stencil life up to 24 hours
High print speed up to 150mm/sec
Headspace method can be used for reflow
Alloy - Sn63 / Pb37
Particle size: 25-45 microns
Metal content of the paste: 89%
Physical/chemical properties
Color/Appearance - Metallic Gray
Copper Mirror Test (for the corrosiveness of the flux) - Passes without violations
Silver chromate test - Passes without discoloration
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The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
To carry out technical calculations and obtain the exact parameters of the goods, use the datasheets from the manufacturer's website.
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