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Whole catalog Materials for production and repairSoldering materials (solder, flux, braid)Soldering paste
Product code:
041170

Solder paste Sn62.8Pb36.8Ag0.4 JF-406800904NC syringe 25 g, medium melting with silver

Medium melting tin-lead solder paste with low-residue no-clean flux. Designed for reflow soldering of SMD elements. For production and repair. Contains silver.
Solder paste Sn62.8Pb36.8Ag0.4 JF-406800904NC syringe 25 g, medium melting with silver
222,60 UAH × = 222,60 UAH
from 1 pc : 222,60 UAH
from 5 pcs : 213,70 UAH ( -4,0%)
from 20 pcs : 204,80 UAH ( -8,0%)

Current balances:

Магазин-Днепр
19 pcs
For Online Orders
19 pcs

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Sn62.8Pb36.8Ag0.4 No-Clean Solder Paste is a tin-lead solder paste composed of 62.8% tin, 36.8% lead, and 0.4% silver.
 
No-clean solder paste is designed for surface mounting (SMT). Contains a special flux, spherical tin powder and a small amount of oxide components. Optimum solder paste viscosity ensures high quality continuous printing. The flux used contains a low ionic halogen activator. After reflow, it has significantly less residues, high insulating surface strength, stable and optimal electrical performance.

Specifications:
 
Solder alloy chemical composition in percent:
  • Sn (tin) - 62.8%
  • Pb (lead) - 36.8%
  • Ag (silver) - 0.4%
Temperature range:
  • preheat: 90-150°C
  • reflow start: 178°C
  • soldering temperature: 190°C - 210°C
  • storage temperature:+5°C to+15°C
 
The viscosity of the paste is optimal for applying to the board through a stencil.
 
Packing: medical syringe 5 ml (weight 25 grams).
Storage conditions: at temperatures between+5°C and+15°C, try to avoid direct sunlight.
Shelf life: 6-8 months, then the properties of the paste deteriorate.

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