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NO-Clean flux is highly reactive, which allows soldering on nickel-plated boards and components. Possesses good wetting properties. Adhesive, holds the components well during the reflow process. This flux ensures good adhesion of the solder on copper and oxidized copper surfaces, even after 2-3 brazing cycles.
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![Flux gel TSF-6502 [10ml]](/files/pic/proskit/stripper/013204-s.jpg)
![Flux gel TSF-6502 [10ml]](/files/pic/proskit/stripper/013204.jpg)
The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
