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"NO CLEAN" type flux. Does not require cleaning. It is characterized by increased adhesion. Provides secure retention of elements on the printed circuit board. Syringe cartridge 10 ml.
A no-rinse high viscosity flux that can be used for deburring, bonding of BGA, CGA and CSP component solder balls and feet and assembly operations such as bonding Flip Chips to PWB substrates.
Recommended for mounting elements in BGA, PGA, PLCC, QFP, CSP packages.
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![Flux gel NC-559-TF [10 ml]](/files/pic/payalnoe/flus/anc559tf-s.jpg)
NC-559-TF
![Flux gel NC-559-TF [10 ml]](/files/pic/payalnoe/flus/anc559tf.jpg)
The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
